Wafer Level 3-D ICs Process Technology
| By: | Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif |
| Publisher: | Springer Nature |
| Print ISBN: | 9780387765327 |
| eText ISBN: | 9780387765341 |
| Edition: | 1 |
| Copyright: | 2008 |
| Format: | Reflowable |
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Table of Contents
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.