RF and Microwave Microelectronics Packaging
| By: | Ken Kuang; Franklin Kim; Sean S. Cahill |
| Publisher: | Springer Nature |
| Print ISBN: | 9781441909831 |
| eText ISBN: | 9781441909848 |
| Edition: | 1 |
| Copyright: | 2010 |
| Format: | Reflowable |
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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.