Wafer Bonding
Applications and Technology| By: | Marin Alexe; Ulrich Gösele |
| Publisher: | Springer Nature |
| Print ISBN: | 9783540210498 |
| eText ISBN: | 9783662108277 |
| Edition: | 1 |
| Copyright: | 2004 |
| Format: | Page Fidelity |
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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.